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W.L. Gore & Associates, GmbH
网址
国家/地区: Germany
展位号:C1747
SiSTEM Technology Ltd
网址
200 ...
国家/地区: United Kingdom
展位号:C2106
200 Packaging and Assembly Equipment
Plating; Electro Chemical Plating for device assembly
202 Other Equipment
Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating
Space simulation; Vacuum chambers
Vacuum drying & out gassing Systems
203 Inspection & Measurement Products
Defect; Particle; Bump; Contamination Detection
Review or Inspection
Flat; Notch Finding System
Microscopes: Optical Microscopes
Thermal Sensing
Measurement
Analysis
Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
205 Nanotechnology Equipment and Tools
Equipment
Nanotechnology Tools
207 Process Equipment
Cleaning; Washing; Drying Equipment for Substrate
Fab Processing
Coat; Develop; Resist Processing; Track Equipment
Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD
Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment
Etching; Stripping; Ashing - Dry and Wet Equipment
Ion; E-Beam Milling Etching Equipment
Plating; Electro Chemical Plating; Deposition Systems
Thermal Processing - Diffusion; Oxidation; Annealing; RTA; RTP Equipment
Transfer Systems for Wafer; Reticles or FPD's
208 Test Equipment
Test Contactor Cleaning; Conditioning Systems
304 Mask Making Materials
Mask and Reticle Handling Products
309 Test Materials
Probe Cards; DUT boards and other probing accessories (incl Ceramic and Special Purpose Probe Cards)
Test Sockets; Contactors and Contact accessories
400 Co
Nanosurf AG
网址
203 ...
国家/地区: Switzerland
展位号:C1229
203 Inspection & Measurement Products
Microscopes: Atomic Force Microscopes (AFM)
205 Nanotechnology Equipment and Tools
Equipment
Nanotechnology Tools
901 Printed
Organic
Flexible and Large Area
Device Manufacturing: Integrated systems
Edwards GmbH
网址
401 ...
国家/地区: Germany
展位号:C1355
401 Sub-systems
Pumps
Vacuum
LAB14
网址
200 ...
国家/地区: Germany
展位号:C1229
200 Packaging and Assembly Equipment
Die Bonding; Attach Equipment
Die Removal Equipment
Dispensing Systems
Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
Printed and Organic Electronic Equipment
Wafer Level Bonders
203 Inspection & Measurement Products
Leak Detection Systems - Vacuum or Gas
Microscopes: Atomic Force Microscopes (AFM)
Microscopes: SEM; Focused Ion Beam (FIB)
TEM
Spectrometers; FTIR; ATR-FTIR; Auger Electron (AES); SIMS
X-ray; XRF; 3-D X-Ray; LEXES Systems
204 MEMS Equipment
Double sided mask aligner
207 Process Equipment
Cleaning; Washing; Drying Equipment for Substrate
Fab Processing
Coat; Develop; Resist Processing; Track Equipment
Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint
601 Design Software
CAD - Computer Automated Design
EDA - Electronic Design Automation; Circuit Design
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